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1. product profile 1.1 general description ip3053cx5, ip3053cx10, IP3053CX15 and ip3053cx20 is a 2, 4, 6 and 8-channel lc low-pass filter array family which is design ed to provide filtering of undesired rf signals on the i/o ports of portable communication or computing devices. in addition, ip3053cx5, ip3053cx10, IP3053CX15 and ip3053cx20 incorpor ates diodes to provide protection to downstream components from electrostatic discharge (esd) voltages as high as 8 kv according iec 61000-4-2 level 4. the devices are fabricated using monolithic silicon te chnology and integrate and incorporate up to 8 inductors and up to 16 diodes in a 0.5 mm pitch wafer-level chip-scale package (wlcsp). 1.2 features and benefits ? pb-free, rohs compliant and free of ha logen and antimony (dark green compliant) ? integrated 2, 4, 6 and 8-channel -type lc-filter network ? 18 channel series resistance; 45 pf (at 2.5 v dc) channel capacitance ? integrated esd protection withstanding 8 kv contact discharge ? wlcsp with 0.5 mm pitch 1.3 applications general purpose electromagnetic interference (emi) and radio frequency interference (rfi) filtering and downstream esd protection for: ? cellular and personal communication system (pcs) mobile handsets ? cordless telephones ? wireless data (wan/lan) systems ip3053cx5; ip3053cx10; IP3053CX15; ip3053cx20 integrated 2, 4, 6 and 8-cha nnel passive emi-filter network with high-level esd protectio n to iec 61000-4-2 level 4 rev. 01 ? 3 may 2010 product data sheet
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 2 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection 2. pinning information 2.1 pinning 2.2 pin description fig 1. pin configuration ip3053cx5 fig 2. pin configuration ip3053cx10 fig 3. pin configuration IP3053CX15 fig 4. pin configuration ip3053cx20 001aak061 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 001aak06 2 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 b2 4 3 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 b2 4 3 001aak06 3 b3 6 5 transparent top view, solder balls facing down bump a1 index area a b c b1 2 1 b2 4 3 b3 6 5 001aak06 4 b4 8 7 table 1. pinning pin description ip3053cx5 ip3053cx10 IP3053CX15 ip3053cx20 a1 and c1 a1 and c1 a1 and c1 a1 and c1 filter channel 1 a2 and c2 a2 and c2 a2 and c2 a2 and c2 filter channel 2 - a3 and c3 a3 and c3 a3 and c3 filter channel 3 - a4 and c4 a4 and c4 a4 and c4 filter channel 4 - - a5 and c5 a5 and c5 filter channel 5 - - a6 and c6 a6 and c6 filter channel 6 - - - a7 and c7 filter channel 7 - - - a8 and c8 filter channel 8 b1 b1 and b2 b1, b2 and b3 b1, b2, b3 and b4 ground
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 3 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection 3. ordering information 4. functional diagram 5. limiting values table 2. ordering information type number package name description version ip3053cx5 wlcsp5 wafer level chip-size package; 5 bumps (2-1-2) ip3053cx5 ip3053cx10 wlcsp10 wafer level chip-size package; 10 bumps (4-2-4) ip3053cx10 IP3053CX15 wlcsp15 wafer level chip-size package; 15 bumps (6-3-6) IP3053CX15 ip3053cx20 wlcsp20 wafer level chip-size package; 20 bumps (8-4-8) ip3053cx20 fig 5. schematic diagram ip3053cx5; ip3053cx10; IP3053CX15; ip3053cx20 008aaa22 5 a1 to a8 b1 to b4 c1 to c8 table 3. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v cc supply voltage ? 0.5 +5.6 v v esd electrostatic discharge voltage iec 61000-4-2 level 4; all pins to ground contact discharge ? 8 +8 kv air discharge ? 15 +15 kv i ch channel current (dc) per channel; t amb = 85 c - 5 ma i ch(ac) channel current (ac) per channel; t amb = 85 c - 50 ma t stg storage temperature ? 65 +150 c t amb ambient temperature ? 40 +85 c
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 4 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection 6. characteristics [1] guaranteed by design. 7. application information 7.1 insertion loss ip3053cx5, ip3053cx10, IP3053CX15 and ip3053cx20 is mainly designed as an emi and rfi filter for multichannel interfaces. the setup for measuring insertion loss in a 50 system is shown in figure 6 . table 4. channel characteristics t amb = 25 c; unless otherwise specified. symbol parameter conditions min typ max unit r s(ch) channel series resistance - 100 - l s(ch) channel series inductance - 35 - nh c ch channel capacitance v bias(dc) = 0 v; f = 100 khz [1] - 47 - pf v bias(dc) = 2.5 v; f = 100 khz [1] - 30 - pf v br breakdown voltage positive clamp; i test = 1 ma 5.8 - 10 v v f forward voltage negative clamp; i f = ? 1 ma ? 1.5 - ? 0.4 v i lr reverse leakage current per channel; v i = 3.5 v - - 0.1 a table 5. frequency characteristics t amb = 25 c; unless otherwise specified. symbol parameter conditions min typ max unit il insertion loss r gen = 50 ; r l = 50 ; 800 mhz < f < 3 ghz 30 - - db f ? 3db cut-off frequency r gen = 50 ; r l = 50 ; v bias(dc) = 0 v; il at 1 mhz ? 3 db - 150 - mhz fig 6. frequency response measurement configuration out 001aai75 5 50 50 v gen dut in test board
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 5 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection as an example, the measured insertion lo ss magnitude for all channels of the ip3053cx10 are shown in figure 7 . a. channel 1 (pin a1 to c1) b. channel 2 (pin a2 to c2) c. channel 3 (pin a3 to c3) d. channel 4 (pin a4 to c4) fig 7. measured insertion loss magnitude 008aaa227 f (mhz) 10 ? 1 10 4 10 3 110 2 10 ? 40 ? 20 0 s 21 (db) ? 60 008aaa230 f (mhz) 10 ? 1 10 4 10 3 110 2 10 ? 40 ? 20 0 s 21 (db) ? 60 008aaa231 f (mhz) 10 ? 1 10 4 10 3 110 2 10 ? 40 ? 20 0 s 21 (db) ? 60 008aaa229 f (mhz) 10 ? 1 10 4 10 3 110 2 10 ? 40 ? 20 0 s 21 (db) ? 60
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 6 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection 7.2 crosstalk the crosstalk measurement configuration of a typical 50 network analyzer (nwa) system for evaluation of the ip3053cx5, ip3053cx10, IP3053CX15 and ip3053cx20 is shown in figure 8 . four typical examples of crosstalk measur ement results of ip3053cx20 are depicted. unused channels are left open. fig 8. crosstalk measurement configuration (1) channel 1 to 2 (pin a1 to c2). (2) channel 1 to 4 (pin a1 to c4). (3) channel 1 to 6 (pin a1 to c6). (4) channel 1 to 8 (pin a1 to c8). fig 9. measured crosstalk between different channels using the example of ip3053cx20 out_2 001aai75 6 50 50 v gen dut in_1 out_1 in_2 test board 50 50 008aaa232 f (mhz) 10 ? 1 10 3 10 4 10 2 110 ? 20 ? 30 ? 40 ? 50 ? 60 ? 10 0 ct (db) ? 70 (1) (2) (3) (4)
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 7 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection 8. package outline fig 10. package outline ip3053cx5 (wlcsp5) wlcsp5_2-1-2_po european projection w lcsp5: wafer level chip-size package; 5 bumps (2-1-2) detail x a a 2 a 1 x a b c e d 2 1 e 2 e 1 e b 1/2 e b1 bump a1 index area table 6. dimensions for figure 10 symbol min typ max unit a 0.60 0.65 0.70 mm a 1 0.22 0.24 0.26 mm a 2 0.38 0.41 0.44 mm b 0.27 0.32 0.37 mm d 0.91 0.96 1.01 mm e 1.23 1.28 1.33 mm e - 0.5 - mm e 1 - 0.435 - mm e 2 - 0.87 - mm
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 8 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection fig 11. package outline ip3053cx10 (wlcsp10) wlcsp10_4-2-4_po european projection w lcsp10: wafer level chip-size package; 10 bumps (4-2-4) detail x a a 2 a 1 x a b c e d e 2 e 1 b2 b1 bump a1 index area e b 4 3 e 3 2 1 1/2 e table 7. dimensions for figure 11 symbol min typ max unit a 0.60 0.65 0.70 mm a 1 0.22 0.24 0.26 mm a 2 0.38 0.41 0.44 mm b 0.27 0.32 0.37 mm d 1.91 1.96 2.01 mm e 1.23 1.28 1.33 mm e - 0.5 - mm e 1 - 0.433 - mm e 2 - 0.866 - mm e 3 - 1.0 - mm
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 9 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection fig 12. package outline IP3053CX15 (wlcsp15) wlcsp15_6-3-6_po european projection w lcsp15: wafer level chip-size package; 15 bumps (6-3-6) detail x a a 2 a 1 d e bump a1 index area x e 2 e e 1 e 3 b 12 4 36 5 a b c 1/2 e b1 b2 b3 table 8. dimensions for figure 12 symbol min typ max unit a 0.60 0.65 0.70 mm a 1 0.22 0.24 0.26 mm a 2 0.38 0.41 0.44 mm b 0.27 0.32 0.37 mm d 2.91 2.96 3.01 mm e 1.23 1.28 1.33 mm e - 0.5 - mm e 1 - 0.433 - mm e 2 - 0.866 - mm e 3 - 1.0 - mm
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 10 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection fig 13. package outline ip3053cx20 (wlcsp20) wlcsp20_8-4-8_po european projection w lcsp20: wafer level chip-size package; 20 bumps (8-4-8) detail x a a 2 a 1 d e bump a1 index area e 2 e e 1 e 3 b 3 2 16 5 48 7 a b c 1/2 e x b1 b2 b3 b4 table 9. dimensions for figure 13 symbol min typ max unit a 0.60 0.65 0.70 mm a 1 0.22 0.24 0.26 mm a 2 0.38 0.41 0.44 mm b 0.27 0.32 0.37 mm d 3.91 3.96 4.01 mm e 1.23 1.28 1.33 mm e - 0.5 - mm e 1 - 0.433 - mm e 2 - 0.866 - mm e 3 - 1.0 - mm
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 11 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection 9. design and assemb ly recommendations 9.1 pcb design guidelines for optimum performance it is recommended to use a non-solder mask pcb design (nsmd), also known as a coppe r-defined design, in corporating laser-drilled micro-vias connecting the ground pads to a buried ground-plane layer. this results in the lowest possible ground inductance and provides the best high frequency and esd performance. for this case, refer to table 10 for the recommended pcb design parameters. 9.2 pcb assembly guidelines for pb-free soldering table 10. recommended pcb design parameters parameter value or specification pcb pad diameter 200 m micro-via diameter 100 m (0.004 inch) solder mask aperture diameter 370 m copper thickness 20 m to 40 m copper finish auni pcb material fr4 table 11. assembly recommendations parameter value or specification solder screen aperture diameter 330 m solder screen thickness 100 m (0.004 inch) solder paste: pb-free snag (3 % to 4 %) cu (0.5 % to 0.9 %) solder to flux ratio 50 : 50 solder reflow profile see figure 14 the device is capable of withstanding at least three reflows of this profile. fig 14. pb-free solder reflow profile 001aai94 3 t reflow(peak) 250 230 217 t ( c) cooling rate pre-heat t 1 t 5 t 4 t 3 t 2 t (s)
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 12 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection 10. abbreviations 11. revision history table 12. characteristics symbol parameter conditions min typ max unit t reflow(peak) peak reflow temperature 230 - 260 c t 1 time 1 soak time 60 - 180 s t 2 time 2 time during t 250 c - - 30 s t 3 time 3 time during t 230 c 10 - 50 s t 4 time 4 time during t > 217 c 30 - 150 s t 5 time 5 - - 540 s dt/dt rate of change of temperature cooling rate - - ? 6 c/s pre-heat 2.5 - 4.0 c/s table 13. abbreviations acronym description dut device under test emi electromagnetic interference esd electrostatic discharge hbm human body model lan local area network nwa network analyzer pcb printed-circuit board pcs personal communication system pda personal digital assistant rfi radio frequency interference rohs restriction of hazardous substances sim subscriber identity module wan wide area network wlcsp wafer-level chip-scale package table 14. revision history document id release date data sheet status change notice supersedes ip3053cx5_cx10_cx15_cx20_1 20100503 product data sheet - -
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 13 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection 12. legal information 12.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 12.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 12.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objec tive specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this document contains the product specification.
ip3053cx5_cx10_cx15_cx20_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 3 may 2010 14 of 15 nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 12.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 13. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors ip3053cx5/cx10/cx15/cx20 2, 4, 6 and 8-channel passive emi- filter network with esd protection ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 3 may 2010 document identifier: ip3053cx5_cx10_cx15_cx20_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 14. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 2.1 pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 2.2 pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 3 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 3 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 application information. . . . . . . . . . . . . . . . . . . 4 7.1 insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 4 7.2 crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 8 package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7 9 design and assembly recommendations . . . 11 9.1 pcb design guidelines . . . . . . . . . . . . . . . . . . 11 9.2 pcb assembly guidelines for pb-free soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 10 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 11 revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 12 legal information. . . . . . . . . . . . . . . . . . . . . . . 13 12.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 12.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 12.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 13 contact information. . . . . . . . . . . . . . . . . . . . . 14 14 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

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